About AM
Atlas Magnetics’ Commitment to Quality
Atlas Magnetics is led by silicon and packaging veterans with track records of leading multiple successful startups shipping billions of ICs to customer projects.
Backgrounds include management at Nvidia, Cypress SoC, Silego (now part of Renesas), and MPS. Experience in advanced packaging, configurability, and monolithic power propels the company vision of merging innovative circuit design with advanced materials in the power, programmable logic, and RF markets.
Our Vision
Atlas Magnetics was founded with a $23.4M USD Series A in June 2021 to address one of the few remaining problems of modern electronics – the massive number of passive components to support core chips and functions. Our vision is to reduce customer board size. As integrated circuits continue to shrink, the relative size impact of the required passive components, support ICs, and routing within a system becomes more and more significant. Furthermore, guaranteeing supply capacity is more difficult for each additional component within the system.
The Atlas Magnetics approach is straightforward – consolidating more system functions at a competitive price requires rethinking how components are incorporated within an IC. Rather than sourcing 3rd -party components Atlas Magnetics focuses on improving the materials and techniques within the packaging to enable passive component development within the IC substrate.
We Merge Innovative Silicon Design with Advanced Materials
Modern, high-value passive components aren’t added onto silicon, and it’s easy to see why. As process technology improves, and transistor sizes decrease, the average price of a wafer skyrockets. Unlike digital gates or power MOSFETs the passive components don’t make significant enough improvements in these new technologies to justify their addition onto the silicon.
Atlas Magnetics approaches this problem from a package-level perspective. Modern packaging techniques combined with proprietary materials allow Atlas Magnetics to build passive components within the package substrate. The result is cheaper, more reliable, and smaller than co-packaging multiple components.
John McDonald
CEO
Experience
Executive at successful startups:
- Cypress MicroSystems
- SiTime
- Silego
20+ patents & patent pending
Ray
COO
Experience
- Du Pont Electronics
- Altera Corp.
- NVIDIA Corporation